Hey, everyone!
Simple post here. The Failure Analysis lab we worked with just sent us a super high resolution Scanning Electron Microscope shot of the Ryzen 7800X3D. It's specifically the cross-sectioned CCD that we showed in our video (already live on the public channel: https://www.youtube.com/watch?v=fFNi3YNJXbY
Since we already published the video, we obviously can't go back and include this image. It doesn't show anything "new" in terms of failures, it's just super cool and educational.
What you're looking at are TSVs, or Through-Silicon Vias, right in the middle in that almost traffic cone-shaped tunnel. There's a scale present on the screen to help illustrate the distances.
Cool stuff! Wanted to share. Thanks for your support, Patreon backers!
(sorry for the annoying watermark - some people were ripping our top-right mark out of the images)
Ernest G. Harvey Jr
2025-04-04 09:10:53 +0000 UTCNorma Emery
2023-08-29 01:36:14 +0000 UTCL'Ancien
2023-08-17 11:33:06 +0000 UTCAgentBirdnest
2023-06-02 18:29:25 +0000 UTCMoritz Wundke
2023-05-19 21:59:24 +0000 UTCRyan MN
2023-05-15 01:16:11 +0000 UTCKelvin
2023-05-14 05:38:09 +0000 UTCnikan1
2023-05-14 01:15:58 +0000 UTCBrian Kelly
2023-05-14 00:23:13 +0000 UTCMikael Mortensen
2023-05-14 00:07:29 +0000 UTC